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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

by Qu, Shichun

  • Used
  • very good
  • Hardcover
  • first
Condition
Very Good
ISBN 10
149391555X
ISBN 13
9781493915552
Seller
Seller rating:
This seller has earned a 5 of 5 Stars rating from Biblio customers.
Bellingham, Washington, United States
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£80.72
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About This Item

Springer-Verlag Publishing, 2014. 1. Hardcover. Very Good. Very Good+; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4 lbs; Red covers with title in white lettering; 2014, Springer-Verlag Publishing; 339 pages; "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications," by Shichun Qu & Yong Liu.

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Details

Bookseller
Salish Sea Books US (US)
Bookseller's Inventory #
SKU-1030AO03403314
Title
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Author
Qu, Shichun
Format/Binding
Hardcover
Book Condition
Used - Very Good
Quantity Available
1
Edition
1
ISBN 10
149391555X
ISBN 13
9781493915552
Publisher
Springer-Verlag Publishing
Date Published
2014

Terms of Sale

Salish Sea Books

All purchases may be returned for any reason within two weeks of date of receipt. A full refund minus all shipping costs is issued when the book is received back again. If the book has been misrepresented in some way, seller will pay all shipping costs.

About the Seller

Salish Sea Books

Seller rating:
This seller has earned a 5 of 5 Stars rating from Biblio customers.
Biblio member since 2005
Bellingham, Washington

About Salish Sea Books

Thank you for taking an interest in one of our books. We specialize in out-of-print or otherwise difficult-to-acquire books. All books are carefully graded. All books are cleaned, checked for binding defects, torn jackets, etc., and any defects are fully corrected before any book is offered for sale. Any defects that cannot be corrected will be mentioned in the description. Major repairs will also be mentioned. All books are shipped in sturdy shipping boxes to prevent unnecessary damage while in transit. Domestic order are shipped with either Delivery Confirmation or Signature Confirmation, the number of which is available upon request. Thanks.

Glossary

Some terminology that may be used in this description includes:

Tight
Used to mean that the binding of a book has not been overly loosened by frequent use.

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