Fundamentals of Microsystems Packaging Hardcover - 2001
by Rao Tummala
From the rear cover
A rigorous and thorough introduction to electronic packaging technologies
The only book to teach microsystems packaging--written by the field's leading authorThis is the book that engineers, technicians, and students want--the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:
*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies--wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom--and the most comprehensive on-the-job reference
MICROSystems PACKAGINGFROM THE GROUND UP
Details
- Title Fundamentals of Microsystems Packaging
- Author Rao Tummala
- Binding Hardcover
- Edition [ Edition: first
- Pages 967
- Volumes 1
- Language ENG
- Publisher McGraw-Hill Education, New York
- Date 2001-05
- Illustrated Yes
- Features Bibliography, Glossary, Illustrated, Index
- ISBN 9780071371698 / 0071371699
- Weight 4.13 lbs (1.87 kg)
- Dimensions 9.25 x 7.5 x 2 in (23.50 x 19.05 x 5.08 cm)
- Library of Congress subjects Electronic packaging, Microelectronic packaging
- Library of Congress Catalog Number 2001273178
- Dewey Decimal Code 621.381
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Fundamentals of Microsystems Packaging
by Tummala, Rao
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Fundamentals of Microsystems Packaging
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Show Details
Fundamentals of Microsystems Packaging
by Tummala, Rao R
- New
- Hardcover
- first
- Condition
- New
- Edition
- First Edition
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780071371698 / 0071371699
- Quantity Available
- 1
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Hygiene, Colorado, United States
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