Mems/Moem Packaging: Concepts, Designs, Materials and Processes Hardcover - 2005 - 1st Edition
by Ken Gilleo
From the rear cover
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AUTHORITATIVE, COST-EFFECTIVE SOLUTIONS FOR MEMS AND MOEMS ASSEMBLIES
This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including:
- Wafer-level packaging
- Microfluidic device packaging
- Optical MEMS packaging
- RF and microwave packaging
- Laser sealing
Readers will find in-depth coverage of assembly technology and manufacturability, including cost issues.
CONTENT THAT SOLVES MEMS AND MOEMS PACKAGING & ASSEMBLY PROBLEMS:
- Engineering fundamentals of packaging for MEMS and MOEMS devices
- Principles, materials, and fabrication of MEMS and MOEMS devices
- Evaluation methods for MEMS and MOEMS packaging challenges
- MEMS packaging processes
- From MEMS and MOEMS to nanotechnology
Details
- Title Mems/Moem Packaging: Concepts, Designs, Materials and Processes
- Author Ken Gilleo
- Binding Hardcover
- Edition number 1st
- Edition 1
- Pages 240
- Volumes 1
- Language ENG
- Publisher McGraw-Hill Companies
- Date 2005-08-01
- Illustrated Yes
- ISBN 9780071455565 / 0071455566
- Weight 1.07 lbs (0.49 kg)
- Dimensions 9.12 x 6.32 x 0.85 in (23.16 x 16.05 x 2.16 cm)
- Library of Congress subjects Optoelectronic devices, Microelectronic packaging
- Library of Congress Catalog Number 2005049594
- Dewey Decimal Code 621.381
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MEMS/MOEM Packaging : Concepts, Designs, Materials and Processes
by Gilleo, Ken
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MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (Nanoscience and Technology)
by Gilleo, Ken
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