Description:
New York: Wiley-Interscience, 1994. First Edition, Second Printing. Hardcover. Near Fine/Near Fine. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket.
Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines � A Focus on Reliability by Michael Pecht - 1994
by Michael Pecht
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Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines � A Focus on Reliability
by Michael Pecht
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Wiley-Interscience, 1994. Hardcover. New. second printing edition. 426 pages. 9.75x6.50x1.25 inches.
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- ISBN 10 0471594466
- ISBN 13 9780471594468
- Publisher Wiley-Interscience
- Date Published 1994
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Pecht, Michael
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael
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New York: Wiley-Interscience, 1994. Second Printing. Hardcover. As New copy in dust jacket. Octavo; xxxi, 426 pages.
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Integrated Circuit
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Hard Cover. New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Integrated Circuit.
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Michael Pecht
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John Wiley & Sons , pp. 426 . Hardback. New.
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Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines – A Focus on Reliability
by Michael Pecht
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- Hardcover
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- 9780471594468 / 0471594466
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Wiley-Interscience, 1994. Hardcover. New. second printing edition. 426 pages. 9.75x6.50x1.25 inches.
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